Adaptation of MWM-Array and MFL Technology for Enhanced Detection/Characterization of Damage from Inside Pipelines

This project will develop an improved nondestructive evaluation (NDE) method for detection and characterization of damage from inside pipelines. The damage conditions of interest include internal corrosion and mechanical damage, as well as external stress corrosion cracking and external corrosion. This will be accomplished by adapting JENTEK Sensors, Inc.'s MWM-Array technology and developing a field deployable MWM-Array tool for inspection from inside pipelines, as well as by applying JENTEK's model-based inverse methods to develop enhanced MFL methodologies. The magnetic field-based MWM-Arrays and model-based inverse methods are used to determine electromagnetic and geometric properties of the pipeline material, which are then related to specific damage conditions of interest. This technology has been successfully applied in the aerospace and manufacturing industries and provides substantially improved performance for imaging surface and buried damage compared to conventional NDE methods. The team for this program is JENTEK, Chevron, Applus/RTD, SIG, and Tuboscope.

Language

  • English

Project

  • Status: Completed
  • Funding: $633943.00
  • Contract Numbers:

    DTPH56-08-T-000009

  • Sponsor Organizations:

    Pipeline and Hazardous Materials Safety Administration

    U.S. Department of Transportation
    East Building, 2nd Floor 1200 New Jersey Avenue, SE
    Washington, DC  United States  20590
  • Project Managers:

    Merritt, James

  • Performing Organizations:

    JENTEK Sensors, Incorporated

    110-1 Clematis Avenue
    Waltham, MA  United States  02453
  • Principal Investigators:

    Goldfine, Neil

  • Start Date: 20080601
  • Expected Completion Date: 0
  • Actual Completion Date: 20120403
  • Source Data: RiP Project 31142

Subject/Index Terms

Filing Info

  • Accession Number: 01492397
  • Record Type: Research project
  • Source Agency: Department of Transportation
  • Contract Numbers: DTPH56-08-T-000009
  • Files: RiP
  • Created Date: Sep 7 2013 1:00AM