Development of Technologies to Improve the Reliability and Intelligence of Aircraft Electrical Wire and Interconnect Systems

To improve the reliability and intelligence of aircraft power systems, there is a need for inexpensive, lightweight sensors that can be incorporated into aircraft electrical wiring interconnection system (EWIS) to ensure proper clamp installation as well as detect clamp malfunction and secondary damage mechanisms of any unsupported wires. During previous Federal Aviation Administration (FAA) funded research, different SMART (Status and Motion Activated Radio frequency Tag) sensor concepts based on a reversibly deactivated/activated radio frequency identification tag were developed. Additional SMART sensors capable of aiding maintenance personnel in the identification of degraded connectors would provide further improvement in EWIS performance. Therefore, the University of Dayton Research Institute proposes to conduct a 12 month period of performance research projects consisting of ten main tasks to design, develop, manufacture, then evaluate different candidate SMART sensors for incorporation into current and future aircraft EWIS.

  • Supplemental Notes:
    • Program Information: Aviation Grants Program


  • English


  • Status: Active
  • Funding: $100000.00
  • Contract Numbers:


  • Sponsor Organizations:

    Federal Aviation Administration

    William J. Hughes Technical Center, Atlantic City International Airport
    Atlantic City, NJ  United States  08405
  • Project Managers:

    Walz, Michael

  • Performing Organizations:

    University of Dayton

    Research Institute
    300 College Park Avenue
    Dayton, OH  United States  45469-0110
  • Start Date: 20110809
  • Expected Completion Date: 0
  • Actual Completion Date: 20120808
  • Source Data: RiP Project 30154

Subject/Index Terms

Filing Info

  • Accession Number: 01478550
  • Record Type: Research project
  • Source Agency: Department of Transportation
  • Contract Numbers: 2011-G-011
  • Files: RIP
  • Created Date: Apr 16 2013 12:57AM